This paper shows the effects of silanated glass particles as a photo resin filler for the embedding of electronic components using a stereolithographic printing approach. It describes the manufacturing process of the filled photo resins and points out the difference of silanated and non-silanated fillers regarding the viscosity, homogeneity, and particle size distributions. In conclusion, the silanated filler with micrometer scaled particle size distributions shows the best result for the planed application.