Characterization of Embedded and Thinned RF Chips
Publikation: Beitrag in Buch/Konferenzbericht/Sammelband/Gutachten › Beitrag in Konferenzband › Beigetragen › Begutachtung
Beitragende
Abstract
This work studies the effect of thinning down chips with transmission line structures for flexible embedding technology. Test chips with 90 Ω grounded coplanar waveguide (G-CPW) transmission lines have been designed and manufactured to characterize the high-frequency performance before and after embedding in sheet molding compound (SMC), and thinning down from 300 µm to 20 µm, Molding first technology enables single-die or multiple-die thinning with the embedding material while being held in the exact position, where the subsequent fan-out copper (Cu) redistribution layer (RDL) structuring realizes the direct contacts to the embedded chip, followed by semi-additive manufacturing of traces. The embedded and thinned chips are characterized by S-parameter measurements in the frequency range from 20 MHz to 65 GHz using a vector network analyzer (VNA). The results show the feasibility of the examined embedding and thinning processes which are suitable for millimeter wave (mmWave) components as shown by the example of a G-CPW transmission line without degrading its RF performance in terms of characteristic impedance and attenuation.
Details
Originalsprache | Englisch |
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Titel | 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) |
Herausgeber (Verlag) | IEEE |
Seiten | 1-6 |
Seitenumfang | 6 |
ISBN (elektronisch) | 9780956808691 |
ISBN (Print) | 978-1-6654-8736-8 |
Publikationsstatus | Veröffentlicht - 14 Sept. 2023 |
Peer-Review-Status | Ja |
Konferenz
Titel | 2023 24th European Microelectronics and Packaging Conference & Exhibition |
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Untertitel | What future do you want to connect with? |
Kurztitel | EMPC 2023 |
Veranstaltungsnummer | 24 |
Dauer | 11 - 14 September 2023 |
Webseite | |
Bekanntheitsgrad | Internationale Veranstaltung |
Ort | Wellcome Genome Campus |
Stadt | Hinxton |
Land | Großbritannien/Vereinigtes Königreich |
Externe IDs
Scopus | 85186139775 |
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ORCID | /0000-0001-6778-7846/work/155291624 |
ORCID | /0000-0003-1319-0870/work/155292029 |
ORCID | /0000-0002-0757-3325/work/155292325 |
ORCID | /0000-0003-2197-6080/work/155292463 |
Schlagworte
Schlagwörter
- Frequency measurement, Radio frequency, Scattering parameters, Semiconductor device measurement, Sensor phenomena and characterization, Thermomechanical processes, Transmission line measurements