Characterization of Embedded and Thinned RF Chips

Publikation: Beitrag in Buch/Konferenzbericht/Sammelband/GutachtenBeitrag in KonferenzbandBeigetragenBegutachtung


This work studies the effect of thinning down chips with transmission line structures for flexible embedding technology. Test chips with 90 Ω grounded coplanar waveguide (G-CPW) transmission lines have been designed and manufactured to characterize the high-frequency performance before and after embedding in sheet molding compound (SMC), and thinning down from 300 µm to 20 µm, Molding first technology enables single-die or multiple-die thinning with the embedding material while being held in the exact position, where the subsequent fan-out copper (Cu) redistribution layer (RDL) structuring realizes the direct contacts to the embedded chip, followed by semi-additive manufacturing of traces. The embedded and thinned chips are characterized by S-parameter measurements in the frequency range from 20 MHz to 65 GHz using a vector network analyzer (VNA). The results show the feasibility of the examined embedding and thinning processes which are suitable for millimeter wave (mmWave) components as shown by the example of a G-CPW transmission line without degrading its RF performance in terms of characteristic impedance and attenuation.


Titel2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)
Herausgeber (Verlag)IEEE
ISBN (Print)978-1-6654-8736-8
PublikationsstatusVeröffentlicht - 14 Sept. 2023


Titel2023 24th European Microelectronics and Packaging Conference & Exhibition
UntertitelWhat future do you want to connect with?
KurztitelEMPC 2023
Dauer11 - 14 September 2023
BekanntheitsgradInternationale Veranstaltung
OrtWellcome Genome Campus
LandGroßbritannien/Vereinigtes Königreich

Externe IDs

Scopus 85186139775
ORCID /0000-0001-6778-7846/work/155291624
ORCID /0000-0003-1319-0870/work/155292029
ORCID /0000-0002-0757-3325/work/155292325
ORCID /0000-0003-2197-6080/work/155292463



  • Radio frequency, Semiconductor device measurement, Thermomechanical processes, Sensor phenomena and characterization, Transmission line measurements, Frequency measurement, Scattering parameters