A 28nm HKMG super low power embedded NVM technology based on ferroelectric FETs

Publikation: Beitrag in Buch/Konferenzbericht/Sammelband/GutachtenBeitrag in KonferenzbandBeigetragenBegutachtung

Beitragende

  • M. Trentzsch - , Global Foundries Dresden (Autor:in)
  • S. Flachowsky - , Global Foundries Dresden (Autor:in)
  • R. Richter - , Global Foundries Dresden (Autor:in)
  • J. Paul - , Global Foundries Dresden (Autor:in)
  • B. Reimer - , Global Foundries Dresden (Autor:in)
  • D. Utess - , Global Foundries Dresden (Autor:in)
  • S. Jansen - , Global Foundries Dresden (Autor:in)
  • H. Mulaosmanovic - , NaMLab - Nanoelectronic materials laboratory gGmbH (Autor:in)
  • S. Muller - , NaMLab - Nanoelectronic materials laboratory gGmbH (Autor:in)
  • S. Slesazeck - , NaMLab - Nanoelectronic materials laboratory gGmbH (Autor:in)
  • J. Ocker - , NaMLab - Nanoelectronic materials laboratory gGmbH (Autor:in)
  • M. Noack - , NaMLab - Nanoelectronic materials laboratory gGmbH, Ferroelectric Memory Company (Autor:in)
  • J. Muller - , Fraunhofer-Institut für Photonische Mikrosysteme (Autor:in)
  • P. Polakowski - , Professur für Optoelektronische Bauelemente und Systeme (gB/FG), Fraunhofer-Institut für Photonische Mikrosysteme (Autor:in)
  • J. Schreiter - , Racyics GmbH (Autor:in)
  • S. Beyer - , Global Foundries Dresden (Autor:in)
  • T. Mikolajick - , Professur für Nanoelektronik, NaMLab - Nanoelectronic materials laboratory gGmbH (Autor:in)
  • B. Rice - , Global Foundries Dresden (Autor:in)

Abstract

We successfully implemented a one-transistor (1T) ferroelectric field effect transistor (FeFET) eNVM into a 28nm gate-first super low power (28SLP) CMOS technology platform using two additional structural masks. The electrical baseline properties remain the same for the FeFET integration and the JTAG-controlled 64 kbit memory shows clearly separated states. High temperature retention up to 250 °C is demonstrated and endurance up to 105 cycles was achieved. The FeFET unique properties make it the best candidate for eNVM solutions in sub-2x technologies for low-cost IoT applications.

Details

OriginalspracheEnglisch
Titel2016 IEEE International Electron Devices Meeting, IEDM 2016
Herausgeber (Verlag)Institute of Electrical and Electronics Engineers Inc.
Seiten11.5.1-11.5.4
ISBN (elektronisch)9781509039012
PublikationsstatusVeröffentlicht - 31 Jan. 2017
Peer-Review-StatusJa

Publikationsreihe

ReiheTechnical Digest - International Electron Devices Meeting, IEDM
ISSN0163-1918

Konferenz

Titel62nd IEEE International Electron Devices Meeting, IEDM 2016
Dauer3 - 7 Dezember 2016
StadtSan Francisco
LandUSA/Vereinigte Staaten

Externe IDs

ORCID /0000-0003-3814-0378/work/169642623