A 28nm HKMG super low power embedded NVM technology based on ferroelectric FETs
Publikation: Beitrag in Buch/Konferenzbericht/Sammelband/Gutachten › Beitrag in Konferenzband › Beigetragen › Begutachtung
Beitragende
Abstract
We successfully implemented a one-transistor (1T) ferroelectric field effect transistor (FeFET) eNVM into a 28nm gate-first super low power (28SLP) CMOS technology platform using two additional structural masks. The electrical baseline properties remain the same for the FeFET integration and the JTAG-controlled 64 kbit memory shows clearly separated states. High temperature retention up to 250 °C is demonstrated and endurance up to 105 cycles was achieved. The FeFET unique properties make it the best candidate for eNVM solutions in sub-2x technologies for low-cost IoT applications.
Details
| Originalsprache | Englisch |
|---|---|
| Titel | 2016 IEEE International Electron Devices Meeting, IEDM 2016 |
| Herausgeber (Verlag) | Institute of Electrical and Electronics Engineers (IEEE) |
| Seiten | 11.5.1-11.5.4 |
| ISBN (elektronisch) | 9781509039012 |
| Publikationsstatus | Veröffentlicht - 31 Jan. 2017 |
| Peer-Review-Status | Ja |
Publikationsreihe
| Reihe | Technical Digest - International Electron Devices Meeting, IEDM |
|---|---|
| ISSN | 0163-1918 |
Konferenz
| Titel | 62nd IEEE International Electron Devices Meeting, IEDM 2016 |
|---|---|
| Dauer | 3 - 7 Dezember 2016 |
| Stadt | San Francisco |
| Land | USA/Vereinigte Staaten |
Externe IDs
| ORCID | /0000-0003-3814-0378/work/169642623 |
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