Thermo-Mechanical Properties of Cis-1,4-Polyisoprene: Influence of Temperature and Strain Rate on Mechanical Properties by Molecular Dynamic Simulations
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Contributors
Abstract
Cis-1,4-polyisoprene is a widely used elastomer that demonstrates particular thermal and mechanical characteristics, in which the latter is influenced by temperature and strain rate. Molecular dynamic simulations were used to obtain thermal conductivities, glass transition temperatures (Tg), and tensile deformation. Thermal conductivities were calculated by applying the Green–Kubo method, and a decrease in thermal conductivity was observed with increasing temperature. Density–temperature relations were used to calculate Tg, which indicates the transition from the glassy to the rubbery state of the material, and this temperature influences mechanical properties. Investigation of the mechanical properties under uniaxial tensile deformation for constant strain rates indicates an increase in the stiffness and strength of the material at lower temperatures, while increasing molecular mobility at higher temperatures results in reducing these properties. The influence of strain rates at constant temperature highlighted the viscoelastic nature of the structure; increasing strain rates resulted in increases in stiffness, strength, elongation at maximum strength, and elongation at break because of restricted molecular relaxation time. The united-atom force field contributes to higher computational efficiency, which is suitable for large-scale simulations. These results provide important information on the thermo-mechanical properties and tunability of cis-1,4-polyisoprene, which supports applications in the production of interactive fiber rubber composites.
Details
| Original language | English |
|---|---|
| Article number | 1179 |
| Journal | Polymers |
| Volume | 17 |
| Issue number | 9 |
| Publication status | Published - May 2025 |
| Peer-reviewed | Yes |
Keywords
ASJC Scopus subject areas
Keywords
- autocorrelation function, cis-1,4-polyisoprene, elasticity modulus, equilibrium molecular dynamic simulation (EMD), glass transition temperature, Green-Kubo method, stress–strain behavior, thermal conductivity, uniaxial tensile deformation