Oxidation behaviour of Ti 2AlN films composed mainly of nanolaminated MAX phase
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Contributors
Abstract
In this paper, we reported the oxidation behaviour of Ti 2AlN films on polycrystalline Al 2O 3 substrates. The Ti 2AlN films composed mainly of nanolaminated MAX phase was obtained by first depositing Ti-Al-N films using reactive sputtering of two elemental Ti and Al targets in Ar/N 2 atmosphere and subsequent vacuum annealing at 800 °C for 1 h. The Ti 2AlN films exhibited excellent oxidation resistance and thermal stability at 600-900 °C in air. Very low mass gain was observed. At low temperature (600 °C), no oxide crystals were observed on film surface. Blade-like θ-Al 2O 3 fine crystals formed on film surfaces at 700-800 °C. At high temperature (900 °C), firstly θ-Al 2O 3 formed on film surface and then transformed into α-Al 2O 3. At 700-900 °C, a continuous Al 2O 3 layer formed on Ti 2AlN films surface, acting as diffusion barrier preventing further oxidation attack. The mechanism of the excellent oxidation resistance of Ti 2AlN films was discussed based on the experimental results.
Details
Original language | English |
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Pages (from-to) | 8959-8966 |
Number of pages | 8 |
Journal | Journal of nanoscience and nanotechnology |
Volume | 11 |
Issue number | 10 |
Publication status | Published - 2011 |
Peer-reviewed | Yes |
Keywords
ASJC Scopus subject areas
Keywords
- Films, Nanolaminated MAX Phase, Oxidation, Ti AlN