Field Simulation of Structured Cylindrical Silicon Interfaces for Power Cable Accessories

Research output: Contribution to book/Conference proceedings/Anthology/ReportConference contributionContributedpeer-review

Contributors

  • A. J. Amalanathan - , Zittau/Görlitz University of Applied Sciences (Author)
  • Stefan Kornhuber - , Zittau/Görlitz University of Applied Sciences (Author)
  • Andre Knapp - , Leibniz Institute of Polymer Research Dresden (Author)
  • Fabian Kopsch - , Leibniz Institute of Polymer Research Dresden (Author)
  • Anett Muller - , Leibniz Institute of Polymer Research Dresden (Author)
  • Andreas Fery - , Leibniz Institute of Polymer Research Dresden (Author)

Abstract

Power cables serve a crucial role in connecting transmission and distribution utilities as a part of expansion in the electricity grid with the recent trend. The electric potential separation in cable applications (joints, bushings and terminations) is controlled by the electrical strength between the solid interfaces. The imperfections in the dielectric insulation caused by surface roughness and assembly inaccuracies at the onsite conditions lead to voids in the interfaces responsible for discharges. These cavities above a critical size could initiate a higher electron avalanche, causing a failure in the insulation at the interface. Our proposed controlled surface structuring of silicone insulation material in the micron range, based on a wrinkleformation process, introduces a controlled cavity volume between the insulation parts, which reduces the number of failuretriggered cavities and extends the interface length simultaneously. All these studies were conducted previously on flat substrates. To more accurately replicate real-world conditions, this work examines the field distribution on a cylindrical surface with a constant gap distance (10 mm) while varying the configuration of the external electrodes. Using COMSOL Multiphysics, theoretical simulations enable the development of an optimal design for investigating the interfacial discharge mechanism in a cylindrical module.

Details

Original languageEnglish
Title of host publication2025 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2025
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Pages177-180
Number of pages4
ISBN (electronic)979-8-3315-8902-8
ISBN (print)979-8-3315-8903-5
Publication statusE-pub ahead of print - Nov 2025
Peer-reviewedYes
Externally publishedYes

Publication series

SeriesAnnual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP
ISSN0084-9162

Conference

Title2025 IEEE Conference on Electrical Insulation and Dielectric Phenomena
Abbreviated titleCEIDP 2025
Conference number100
Duration14 - 17 September 2025
Website
Degree of recognitionInternational event
LocationUniversity of Manchester
CityManchester
CountryUnited Kingdom