Nanoparticles (NPs) can improve mechanical properties of construction elements. However, the integration is not trivial due to the nanoscopic nature of the particles and the different material properties of particle and device: new processing routes have to be found for homogeneous incorporation. Therefore, a wet chemical synthesis is established to incorporate various ceramic NPs such as TiO2, TiC, SiC, andWCin copper films in desired concentrations. Depending on the kind and concentrationofNPs,hardnessandwear resistance of copper are enhanced.The resultingmetalmatrix composite films are thus of high interest for various applications such as reinforced electrical contacts andinaerospaceandautomotivetechnology.Theenergyreleasedinanexothermic reactionofareactive multilayer system (RMS) can be used as a precise and well-defined local heat source for joining the surface of polymers. Inthis case,aRMSconsistingof alternating layers of nickelandaluminumis used. ThedesignoftheRMSisadjustedinawaythatdespitetheintensivebutveryshort reactionnodamaging ofthepolymersoccurs.Thejoiningprocesstakesonlymillisecondsanddoesnotrequireanypre-orposttreatment of the polymers.With the optimal joining parameters, e.g., the joining load, for fiber nonreinforced polymers tensile strengths can be achieved, which lead to a material failure by tensile attempts. Preliminary tests of fiber reinforced polymers result in a tensile strength that is characteristic for adhesive polymer bonding. Model simulations show that only the first few micrometers of the materials surface are in a liquid state for a very short period of time. In addition to the applied joining load,thematerialscompositionandspecificallytheresultingsolidificationprocessoftheliquidpolymer phase result in a strong bond between polymer samples that have to be joined.Materials with different thermal expansioncoefficients are difficult to jointhermally.Amongthemis the joining of solar cells. It is conventionally carried out by heating the whole assembly. Due to the thermal differences between tabbing wire and silicon, deformations as well as changes in the microstructure can occur. In the worst case, damage of thewhole assembly is possible.Uponinspection of the joining process, the high energy consumption of the process itself is also critical.