3D stacked buck converter with 15μm thick spiral inductor on silicon interposer for fine-grain power-supply voltage control in SiP's

Research output: Contribution to book/Conference proceedings/Anthology/Report › Conference contribution › Contributed › peer-review

Contributors

  • Koichi Ishida - , Chair of Circuit Design and Network Theory, Tokyo University of Agriculture (Author)
  • Koichi Takemura - , ASET (Association of Super-Advanced Electronics Technologies) (Author)
  • Kazuhiro Baba - , ASET (Association of Super-Advanced Electronics Technologies) (Author)
  • Makoto Takamiya - , Tokyo University of Agriculture (Author)
  • Takayasu Sakurai - , Tokyo University of Agriculture (Author)

Abstract

This paper proposes a 3D stacked buck converter with a 15μm thick spiral inductor on a silicon Interposer, which is suitable for fine-grain power-supply voltage control in SiP's. Our newly developed silicon interposer technology realizes a fine-pitch design rule (Line/Space=20μm/20μm, via hole diameter =30um) at the metal thickness of 15μm as well as conventional interposers with 5μm metal thickness. The measurement result shows that the 15μm thick inductor improves the power efficiency of the buck converter by 12% at the output current of 100mA compared with that by the conventional 5-μm thick inductor.

Details

Original languageEnglish
Title of host publication2010 IEEE International 3D Systems Integration Conference (3DIC)
PublisherIEEE
Pages1-4
Number of pages4
ISBN (print)978-1-4577-0525-0
Publication statusPublished - 18 Nov 2010
Peer-reviewedYes

Conference

Title2010 IEEE International 3D Systems Integration Conference (3DIC)
Duration16 - 18 November 2010
LocationMunich, Germany

External IDs

Scopus 79955969971
ORCID /0000-0002-4152-1203/work/165453414

Keywords

Keywords

  • Inductors, Silicon, Metals, Spirals, Large scale integration, Resistance, CMOS integrated circuits