2D High-Temperature Superconductor Integration in Contact Printed Circuit Boards

Research output: Contribution to journalResearch articleContributedpeer-review

Contributors

  • Christian N. Saggau - , Leibniz Institute for Solid State and Materials Research Dresden (Author)
  • Sanaz Shokri - , Institute of Applied Physics, Leibniz Institute for Solid State and Materials Research Dresden (Author)
  • Mickey Martini - , Institute of Applied Physics, Leibniz Institute for Solid State and Materials Research Dresden (Author)
  • Tommaso Confalone - , Institute of Applied Physics, Leibniz Institute for Solid State and Materials Research Dresden (Author)
  • Yejin Lee - , Institute of Applied Physics, Leibniz Institute for Solid State and Materials Research Dresden (Author)
  • Daniel Wolf - , Leibniz Institute for Solid State and Materials Research Dresden (Author)
  • Genda Gu - , Brookhaven National Laboratory (Author)
  • Valentina Brosco - , University of Rome La Sapienza, Enrico Fermi Center (Author)
  • Domenico Montemurro - , Universita' di Napoli Federico II (Author)
  • Valerii M. Vinokur - , Terra Quantum AG, City University of New York (Author)
  • Kornelius Nielsch - , Institute of Applied Physics, Chair of Metallic Materials and Metal Physics, Leibniz Institute for Solid State and Materials Research Dresden (Author)
  • Nicola Poccia - , Leibniz Institute for Solid State and Materials Research Dresden (Author)

Abstract

Inherent properties of superconducting Bi2Sr2CaCu2O8+x films, such as the high superconducting transition temperature Tc, efficient Josephson coupling between neighboring CuO layers, and fast quasiparticle relaxation dynamics, make them a promising platform for advances in quantum computing and communication technologies. However, preserving two-dimensional superconductivity during device fabrication is an outstanding experimental challenge because of the fast degradation of the superconducting properties of two-dimensional flakes when they are exposed to moisture, organic solvents, and heat. Herein, to realize superconducting devices utilizing two-dimensional (2D) superconducting films, we develop a novel fabrication technique relying on the cryogenic dry transfer of printable circuits embedded into a silicon nitride membrane. This approach separates the circuit fabrication stage requiring chemically reactive substances and ionizing physical processes from the creation of the thin superconducting structures. Apart from providing electrical contacts in a single transfer step, the membrane encapsulates the surface of the crystal, shielding it from the environment. The fabricated atomically thin Bi2Sr2CaCu2O8+x-based devices show a high superconducting transition temperature of Tc ≃ 91 K close to that of the bulk crystal and demonstrate stable superconducting properties.

Details

Original languageEnglish
Pages (from-to)51558-51564
Number of pages7
JournalACS Applied Materials and Interfaces
Volume15
Issue number44
Early online date25 Oct 2023
Publication statusPublished - 8 Nov 2023
Peer-reviewedYes

External IDs

PubMed 37878903

Keywords

ASJC Scopus subject areas

Keywords

  • 2D materials, contact printing, high-temperature superconductivity, via contacts