Soldering and Surface Mount Technology

ISSNs: 0954-0911, 0263-0060

Emerald Group Publishing, Bingley

Scopus rating (2023): CiteScore 4.1 SJR 0.365 SNIP 0.922

Journal

Titles	Soldering and Surface Mount Technology Soldering & surface mount technology Brazing & soldering
Additional searchable titles	Soldering & Surface Mount Technology, Soldering Surface Mount Technology
ISSNs	0954-0911, 0263-0060
Publisher	Emerald Group Publishing, Bingley
ZDB-ID	1005675-0
ZDB-ID	2015855-5

Keywords

ASJC Scopus subject areas

Materials Science (all)
Condensed Matter Physics
Electrical and Electronic Engineering

Library keywords

670 Manufacturing

Characterisation of Cu/Cu bonding using self-assembled monolayer

Lykova, M., Panchenko, I., Künzelmann, U., Reif, J., Geidel, M., Wolf, M. J. & Lang, K. D., 27 Mar 2018, In: Soldering and Surface Mount Technology. 30, 2, p. 106-111 6 p.

Research output: Contribution to journal › Research article › Contributed › peer-review

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Research Portal of the TU Dresden

Soldering and Surface Mount Technology

Keywords

ASJC Scopus subject areas

Library keywords

Related content

Characterisation of Cu/Cu bonding using self-assembled monolayer