Non-destructive validation method for understanding water uptake processes of moldings in electronic packaging
Activity: Talk or presentation at external institutions/events › Talk/Presentation › Contributed
Persons and affiliations
- Paul Gierth - , Fraunhofer Institute for Ceramic Technologies and Systems (Speaker)
- Lars Rebenklau - , Fraunhofer Institute for Ceramic Technologies and Systems (Speaker)
- Uta Gierth - , Fraunhofer Institute for Ceramic Technologies and Systems (Speaker)
- Ulrike Langklotz - , Chair of Inorganic Non-Metallic Materials (Speaker)
- Michael Schneider - , Fraunhofer Institute for Ceramic Technologies and Systems, Leibniz Institute for Solid State and Materials Research Dresden (Speaker)
Date
2020 → …
Description
The long time stability of molding compounds in electronic packages is critical for many applications.Modern characterization methods focusing on pass / fail criteria, so that a deeper understanding of
degradation mechanisms could not be achieved in that way. EIS and FTIR , commonly used in corrosion
research, were transferred and demonstrated as validation method for the water uptake and chemical
changing during loading scenarios. The usability of these non-destructive methods will be demonstrated
and the results were used to generate degradation models for such molding materials.
Conference
| Title | Sensor and Measurement Science International |
|---|---|
| Conference number | |
| Duration | 22 - 25 June 2020 |
| Location | |
| City | Nuremberg |
| Country | Germany |