Transfer impedance at high frequencies

Publikation: Beitrag in Buch/Konferenzbericht/Sammelband/GutachtenBeitrag in KonferenzbandBeigetragenBegutachtung

Beitragende

  • H. G. Krauthäuser - , Professur für Theoretische Elektrotechnik und Elektromagnetische Verträglichkeit, Otto von Guericke University Magdeburg (Autor:in)
  • J. Nitsch - , Otto von Guericke University Magdeburg (Autor:in)
  • S. Tkachenko - , Otto von Guericke University Magdeburg (Autor:in)
  • N. Korovkin - , Otto von Guericke University Magdeburg (Autor:in)
  • H. J. Scheibe - , Otto von Guericke University Magdeburg (Autor:in)

Abstract

A partially new analysis method to determine the transfer impedance (TI) of coaxial cables is proposed. The method involves two steps. The first (experimental) step consists in the determination of the voltage between the interior wire and the cable shield which is exposed to an exterior TEM field. In the experiment the investigated cable forms a semicircular loop, whose plane is orthogonal to an ideally conductive plane. The measurements have been performed in a GTEM cell. In the second step the calculation of the TI of the cable is carried out. These calculations are based on the analytical solutions for the current in the cable shield. It is shown that with the proposed method - in principal one can determine the complex transfer impedance for frequencies up to 10 GHz for typical cable diameters. Furthermore, the experimental setup is rather simple compared to other methods. At the moment, the evaluation of the experimental data is limited to 600-700 MHz, approximately. This is due to the lack of a more adequate Green's function for the description of the loop in the field inside the GTEM cell.

Details

OriginalspracheEnglisch
Titel2005 International Symposium on Electromagnetic Compatibility, EMC 2005
Herausgeber (Verlag)Institute of Electrical and Electronics Engineers Inc.
Seiten228-233
Seitenumfang6
ISBN (Print)0780393805, 9780780393806
PublikationsstatusVeröffentlicht - 2005
Peer-Review-StatusJa

Publikationsreihe

ReiheIEEE International Symposium on Electromagnetic Compatibility (EMC)
Band1
ISSN2158-110X

Konferenz

Titel2005 International Symposium on Electromagnetic Compatibility, EMC 2005
Dauer8 - 12 August 2005
StadtChicago, IL
LandUSA/Vereinigte Staaten

Externe IDs

ORCID /0000-0002-3894-9831/work/142252671