Order Release Methods in Semiconductor Manufacturing: State-of-the-Art in Science and Lessons from Industry

Publikation: Beitrag in Buch/Konferenzbericht/Sammelband/GutachtenBeitrag in KonferenzbandBeigetragenBegutachtung

Abstract

This contribution presents an industry case study as well as an analysis of the state-of-the-art in science concerning order release methods in wafer manufacturing in the semiconductor industry. The release of orders into the fab significantly influences critical parameters such as WIP, cycle time and throughput. We examine the processes currently applied in industry, indicate the effects of this order release approach on the performance of high-mix, high-volume fabs and establish a link to the analyzed scientific literature to develop a concept for meaningful automation of the release decision.

Details

OriginalspracheEnglisch
Titel31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2020)
Herausgeber (Verlag)Wiley-IEEE Press
ISBN (elektronisch)9781728158778
PublikationsstatusVeröffentlicht - Sept. 2020
Peer-Review-StatusJa

Externe IDs

ORCID /0000-0002-3197-6159/work/142235850
ORCID /0000-0002-3549-080X/work/142245951
ORCID /0000-0001-6942-3763/work/142252884

Schlagworte

Schlagwörter

  • Throughput, Dispatching, Industries, Manufacturing processes, workload control, state-of-the-art review, case study, factory automation, Business, Fabrication, order release