Order Release Methods in Semiconductor Manufacturing: State-of-the-Art in Science and Lessons from Industry
Publikation: Beitrag in Buch/Konferenzbericht/Sammelband/Gutachten › Beitrag in Konferenzband › Beigetragen › Begutachtung
Beitragende
Abstract
This contribution presents an industry case study as well as an analysis of the state-of-the-art in science concerning order release methods in wafer manufacturing in the semiconductor industry. The release of orders into the fab significantly influences critical parameters such as WIP, cycle time and throughput. We examine the processes currently applied in industry, indicate the effects of this order release approach on the performance of high-mix, high-volume fabs and establish a link to the analyzed scientific literature to develop a concept for meaningful automation of the release decision.
Details
Originalsprache | Englisch |
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Titel | 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2020) |
Herausgeber (Verlag) | Wiley-IEEE Press |
ISBN (elektronisch) | 9781728158778 |
Publikationsstatus | Veröffentlicht - Sept. 2020 |
Peer-Review-Status | Ja |
Externe IDs
ORCID | /0000-0002-3197-6159/work/142235850 |
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ORCID | /0000-0002-3549-080X/work/142245951 |
ORCID | /0000-0001-6942-3763/work/142252884 |
Schlagworte
Schlagwörter
- Throughput, Dispatching, Industries, Manufacturing processes, workload control, state-of-the-art review, case study, factory automation, Business, Fabrication, order release