Multifunctional system integration in flexible substrates
Publikation: Beitrag in Buch/Konferenzbericht/Sammelband/Gutachten › Beitrag in Konferenzband › Beigetragen › Begutachtung
Beitragende
Abstract
In this paper we present a technology developed for reliable electrical interconnection on film substrates and between vertically stacked film layers. Applying through-hole via technologies for 3D foil stacks enables multi-functionality and RF performance combined with open form-factor and very cost-efficient manufacturing of conformable electronic modules. The manufacture of fine line metal patterns (line /space geometries below 20μm) on film substrates is performed by cost-effective roll-to-roll technology. Furthermore procedures and technologies for handling and lamination of film based sub-modules have been developed. Also the manufacture and handling of ultra-thin and flexible integrated circuits has been combined with placement of SMD type passive and with integrated printed passive components in the same technology.
Details
Originalsprache | Englisch |
---|---|
Titel | Proceedings - Electronic Components and Technology Conference |
Herausgeber (Verlag) | Institute of Electrical and Electronics Engineers Inc. |
Seiten | 1482-1487 |
Seitenumfang | 6 |
ISBN (elektronisch) | 9781479924073 |
Publikationsstatus | Veröffentlicht - 11 Sept. 2014 |
Peer-Review-Status | Ja |
Publikationsreihe
Reihe | Electronic Components and Technology Conference (ECTC) |
---|---|
ISSN | 0569-5503 |
Konferenz
Titel | 2014 IEEE 64th Electronic Components and Technology Conference |
---|---|
Kurztitel | ECTC 2014 |
Veranstaltungsnummer | 64 |
Dauer | 27 - 30 Mai 2014 |
Stadt | Orlando |
Land | USA/Vereinigte Staaten |
Externe IDs
ORCID | /0000-0002-0757-3325/work/139064811 |
---|