Method for Reducing the Thickness of Solid-State Layers Provided with Components

Publikation: Geistiges EigentumPatentanmeldung/Patent

Beitragende

  • Marko Swoboda - , Infineon Technologies AG (Erfinder:in)
  • Ralf Rieske - , Infineon Technologies AG (Erfinder:in)
  • Christian Beyer - (Erfinder:in)
  • Jan Richter - (Erfinder:in)
  • Siltectra GmbH

Abstract

The invention relates to a method for separating at least one solid-state layer (4) from at least one solid (1). The method according to the invention includes the steps of: producing a plurality of modifications (9) by means of laser beams in the interior of the solid (1) in order to form a separation plane (8); producing a composite structure by arranging or producing layers and/or components (150) on or above an initially exposed surface (5) of the solid (1), the exposed surface (5) being part of the solid-state layer (4) to be separated; introducing an external force into the solid (1) in order to create stresses in the solid (1), the external force being so great that the stresses cause a crack to propagate along the separation plane (8), wherein the modifications for forming the separation plane (8) are produced before the composite structure is produced.

Details

The invention relates to a method for separating at least one solid-state layer (4) from at least one solid (1). The method according to the invention includes the steps of: producing a plurality of modifications (9) by means of laser beams in the interior of the solid (1) in order to form a separation plane (8); producing a composite structure by arranging or producing layers and/or components (150) on or above an initially exposed surface (5) of the solid (1), the exposed surface (5) being part of the solid-state layer (4) to be separated; introducing an external force into the solid (1) in order to create stresses in the solid (1), the external force being so great that the stresses cause a crack to propagate along the separation plane (8), wherein the modifications for forming the separation plane (8) are produced before the composite structure is produced.

OriginalspracheEnglisch
IPC (Internationale Patentklassifikation)B23K 103/ 00 A N
VeröffentlichungsnummerUS2021197314
Anmeldedatum15 Jan. 2018
Land/GebietUSA/Vereinigte Staaten
Prioritätsdatum15 Jan. 2018
PrioritätsnummerWO2018EP50902
PublikationsstatusVeröffentlicht - 1 Juli 2021
Extern publiziertJa
No renderer: customAssociatesEventsRenderPortal,dk.atira.pure.api.shared.model.researchoutput.Patent

Externe IDs

ORCID /0000-0003-2572-1149/work/208796514