Method for Reducing the Thickness of Solid-State Layers Provided with Components
Publikation: Geistiges Eigentum › Patentanmeldung/Patent
Beitragende
- Siltectra GmbH
Abstract
The invention relates to a method for separating at least one solid-state layer (4) from at least one solid (1). The method according to the invention includes the steps of: producing a plurality of modifications (9) by means of laser beams in the interior of the solid (1) in order to form a separation plane (8); producing a composite structure by arranging or producing layers and/or components (150) on or above an initially exposed surface (5) of the solid (1), the exposed surface (5) being part of the solid-state layer (4) to be separated; introducing an external force into the solid (1) in order to create stresses in the solid (1), the external force being so great that the stresses cause a crack to propagate along the separation plane (8), wherein the modifications for forming the separation plane (8) are produced before the composite structure is produced.
Details
The invention relates to a method for separating at least one solid-state layer (4) from at least one solid (1). The method according to the invention includes the steps of: producing a plurality of modifications (9) by means of laser beams in the interior of the solid (1) in order to form a separation plane (8); producing a composite structure by arranging or producing layers and/or components (150) on or above an initially exposed surface (5) of the solid (1), the exposed surface (5) being part of the solid-state layer (4) to be separated; introducing an external force into the solid (1) in order to create stresses in the solid (1), the external force being so great that the stresses cause a crack to propagate along the separation plane (8), wherein the modifications for forming the separation plane (8) are produced before the composite structure is produced.
| Originalsprache | Englisch |
|---|---|
| IPC (Internationale Patentklassifikation) | B23K 103/ 00 A N |
| Veröffentlichungsnummer | US2021197314 |
| Anmeldedatum | 15 Jan. 2018 |
| Land/Gebiet | USA/Vereinigte Staaten |
| Prioritätsdatum | 15 Jan. 2018 |
| Prioritätsnummer | WO2018EP50902 |
| Publikationsstatus | Veröffentlicht - 1 Juli 2021 |
| Extern publiziert | Ja |
Externe IDs
| ORCID | /0000-0003-2572-1149/work/208796514 |
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