Method for Reducing the Thickness of Solid-State Layers Provided with Components

Research output: Intellectual property › Patent application/Patent

Contributors

  • Marko Swoboda - , Infineon Technologies AG (Inventor)
  • Ralf Rieske - , Infineon Technologies AG (Inventor)
  • Christian Beyer - (Inventor)
  • Jan Richter - (Inventor)
  • Siltectra GmbH

Abstract

The invention relates to a method for separating at least one solid-state layer (4) from at least one solid (1). The method according to the invention includes the steps of: producing a plurality of modifications (9) by means of laser beams in the interior of the solid (1) in order to form a separation plane (8); producing a composite structure by arranging or producing layers and/or components (150) on or above an initially exposed surface (5) of the solid (1), the exposed surface (5) being part of the solid-state layer (4) to be separated; introducing an external force into the solid (1) in order to create stresses in the solid (1), the external force being so great that the stresses cause a crack to propagate along the separation plane (8), wherein the modifications for forming the separation plane (8) are produced before the composite structure is produced.

Details

The invention relates to a method for separating at least one solid-state layer (4) from at least one solid (1). The method according to the invention includes the steps of: producing a plurality of modifications (9) by means of laser beams in the interior of the solid (1) in order to form a separation plane (8); producing a composite structure by arranging or producing layers and/or components (150) on or above an initially exposed surface (5) of the solid (1), the exposed surface (5) being part of the solid-state layer (4) to be separated; introducing an external force into the solid (1) in order to create stresses in the solid (1), the external force being so great that the stresses cause a crack to propagate along the separation plane (8), wherein the modifications for forming the separation plane (8) are produced before the composite structure is produced.

Original languageEnglish
IPC (International Patent Classification)B23K 103/ 00 A N
Patent numberUS2021197314
Filing date15 Jan 2018
Country/TerritoryUnited States of America
Priority date15 Jan 2018
Priority numberWO2018EP50902
Publication statusPublished - 1 Jul 2021
Externally publishedYes
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External IDs

ORCID /0000-0003-2572-1149/work/208796514