Hafnium oxide (HfO2), zirconium oxide (ZrO2), and the solid-solution (Hf1-xZrxO2) system continue to be some of the most relevant ferroelectric materials, in particular, for their promising application in CMOS integrated ferroelectric memories. Recent understanding of the influence of oxygen supplied during film deposition on the structural phase formation process in Hf1-xZrxO2 films has drawn attention to a commonly overlooked parameter for tuning ferroelectric and electrical properties of these films. In this paper, a comparison of O3 and O2 plasma used as the oxygen source in an atomic layer deposition process for Hf1-xZrxO2 films within the full compositional range is discussed. A combination of structural and electrical characterization methods grant insight on the influence of each of the oxygen sources on the crystalline phase formation during deposition of Hf1-xZrxO2 films. These observations are then correlated to the material's behavior regarding its ferroelectric and electrical properties; mainly, dielectric constant, ferroelectric remanent polarization, and number of electric field cycles to breakdown.