Foreword: Special Section on Advanced Packaging, Materials, Processing, and Reliability: Cutting-Edge Solutions for High-Density Wafer-/Panel-Level and Thin, Flexible, Mobile Packages

Publikation: Beitrag in FachzeitschriftLeitartikel (Editorial)BeigetragenBegutachtung



This special section is built from the selected work initially presented at the 7th Electronics System-Integration Technology Conference (ESTC), a premier biannual European scientific conference event in the field of microelectronics packaging and system integration, held on September 18–20, 2018, at the Westin Bellevue Hotel in Dresden, Germany, co-sponsored and co-organized by the IEEE Electronics Packaging Society (EPS). This year, ESTC 2020 will be held on September in Vestfold, Norway. ESTC aims to attract new and original contend contributions and to support authors in the publication process. Therefore, ESTC is very grateful to the IEEE Transactions On Components, Packaging, And Manufacturing Technology (CPMT) Editor, Ravi Mahajan, and to EPS Executive Director Denise Manning, who enabled such an additional extended publication process. Selected ESTC 2018 conference contributions, identified by the technical program committees and by the votes of the audience, have been peer-reviewed for publication as significantly extended versions in this special section of the IEEE EPS CPMT journal. The following articles cover advanced packaging, materials, processing, and reliability topics toward cutting-edge solutions for high-density wafer-/panel-level as well as thin, flexible, mobile packages.


Seiten (von - bis)3-4
FachzeitschriftIEEE Transactions on Components, Packaging and Manufacturing Technology
PublikationsstatusVeröffentlicht - Jan. 2020

Externe IDs

Scopus 85078348412
ORCID /0000-0002-0757-3325/work/139064884



  • Special issues and sections, Meetings, Packaging, Reliability, Manufacturing, Intermetallic