Flexible and stretchable redistribution layer with embedded chips for human-machine interface

Publikation: Beitrag in Buch/Konferenzbericht/Sammelband/GutachtenBeitrag in KonferenzbandBeigetragenBegutachtung

Abstract

Suitable stretchable electronics is the key to promote future human-machine collaboration to facilitate processes in daily life. Sensors and actuators on humans will enable a close and yet unhesitating interaction with robots by translating data between biological and technical systems. This paper describes our first approach for chip integration and stretchable interconnect manufacturing in order to achieve reliable stretchable interconnects. Therefore inkjet printed silver horseshoe-interconnects with a radius of 500µm on spin coated polyurethane substrate are tested on a self-developed stretch test setup. More than 400 stretch and release cycles on 10% and 20% stretching were achieved. Furthermore, a polymer chip-embedding process by polymer casting is shown to apply fan-out redistribution layer directly on thin chip carrier. Those carriers can be integrated in stretchable foils in order to achieve miniaturized and low-profile assemblies for human-machine interfaces.

Details

OriginalspracheEnglisch
TitelIEEE 8th Electronics System-Integration Technology Conference (ESTC) 2020
ErscheinungsortTonsberg
Herausgeber (Verlag)IEEE Xplore
Seitenumfang5
ISBN (elektronisch)978-1-7281-6293-5
ISBN (Print)978-1-7281-6294-2
PublikationsstatusVeröffentlicht - 15 Sept. 2020
Peer-Review-StatusJa

Publikationsreihe

ReiheElectronics System-Integration Technology Conference, ESTC
ISSN2687-9700

Konferenz

Titel8th IEEE Electronics System-Integration Technology Conference, ESTC 2020
Dauer15 - 18 September 2020
StadtTonsberg, Vestfold
LandNorwegen

Externe IDs

ORCID /0000-0002-0757-3325/work/139064781
ORCID /0000-0001-6778-7846/work/142240135
ORCID /0000-0002-6286-5064/work/142240638

Schlagworte