Design of an Antenna-In-Package for 180 GHz Chip-To-Chip Communication

Publikation: Beitrag in Buch/Konferenzbericht/Sammelband/GutachtenBeitrag in KonferenzbandBeigetragenBegutachtung

Beitragende

Abstract

This paper presents the design of an 8 × 8 antenna array operating at 180 GHz for chip-to-chip and board-to-board communication. The work is developed as part of the E4C project, targeting high data rates and energy efficiency in short-range communication. The proposed system supports four communication links, demonstrating its compatibility for energy-efficient applications in high-performance computing systems. By applying passive phase shifting and optimizing element spacing, the designed antenna achieves a minimum desired bandwidth of 30 GHz and a gain of 20.7 dB, 17.2 dB and 15 dB for link 1,2 (link 2 and 3 using the same antenna) and link 4 respectively. Simulation results validate the performance, ensuring minimal mutual coupling between elements.

Details

OriginalspracheEnglisch
Titel2025 16th German Microwave Conference (GeMiC)
Herausgeber (Verlag)Institute of Electrical and Electronics Engineers (IEEE)
Seiten25-28
Seitenumfang4
ISBN (elektronisch)9783982039749
ISBN (Print)979-8-3315-2179-0
PublikationsstatusVeröffentlicht - 19 März 2025
Peer-Review-StatusJa

Konferenz

Titel16th German Microwave Conference
KurztitelGeMiC 2025
Veranstaltungsnummer16
Dauer17 - 19 März 2025
Webseite
OrtTechnische Universität Dresden
StadtDresden
LandDeutschland

Externe IDs

Scopus 105007146298
ORCID /0000-0002-0757-3325/work/186183047

Schlagworte

Schlagwörter

  • Antenna arrays, Antenna measurements, Antenna-in-package, Bandwidth, Beam steering, Energy efficiency, Gain, High performance computing, Simulation, Systems support, Antenna-In-Package, Beam Steering, Board-To-Board Communication, Millimeter-Wave