Design of an Antenna-In-Package for 180 GHz Chip-To-Chip Communication

Research output: Contribution to book/Conference proceedings/Anthology/ReportConference contributionContributedpeer-review

Abstract

This paper presents the design of an 8 × 8 antenna array operating at 180 GHz for chip-to-chip and board-to-board communication. The work is developed as part of the E4C project, targeting high data rates and energy efficiency in short-range communication. The proposed system supports four communication links, demonstrating its compatibility for energy-efficient applications in high-performance computing systems. By applying passive phase shifting and optimizing element spacing, the designed antenna achieves a minimum desired bandwidth of 30 GHz and a gain of 20.7 dB, 17.2 dB and 15 dB for link 1,2 (link 2 and 3 using the same antenna) and link 4 respectively. Simulation results validate the performance, ensuring minimal mutual coupling between elements.

Details

Original languageEnglish
Title of host publication2025 16th German Microwave Conference (GeMiC)
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Pages25-28
Number of pages4
ISBN (electronic)9783982039749
ISBN (print)979-8-3315-2179-0
Publication statusPublished - 19 Mar 2025
Peer-reviewedYes

Conference

Title16th German Microwave Conference
Abbreviated titleGeMiC 2025
Conference number16
Duration17 - 19 March 2025
Website
LocationTechnische Universität Dresden
CityDresden
CountryGermany

External IDs

Scopus 105007146298
ORCID /0000-0002-0757-3325/work/186183047

Keywords

Keywords

  • Antenna arrays, Antenna measurements, Antenna-in-package, Bandwidth, Beam steering, Energy efficiency, Gain, High performance computing, Simulation, Systems support, Antenna-In-Package, Beam Steering, Board-To-Board Communication, Millimeter-Wave