Comparison of IGCT and IGBT for the use in the modular multilevel converter for HVDC applications

Publikation: Beitrag in Buch/Konferenzbericht/Sammelband/GutachtenBeitrag in KonferenzbandBeigetragenBegutachtung

Abstract

This paper describes briefly the modeling of the modular multilevel converter, which was introduced by Rainer Marquardt [1]. The mathematical model is used to calculate the average losses and junction temperature of the semiconductor devices in dependence on the converter output power. The junction temperature, the semiconductor losses and their several components are shown in order to compare a converter with IGCTs and a converter with IGBTs as switches. The comparison is made to show in which operating point the one or the other has its advantages.

Details

OriginalspracheEnglisch
Titel9th International Multi-Conference on Systems, Signals & Devices
ErscheinungsortChemnitz
Herausgeber (Verlag)Wiley-IEEE Press
Seitenumfang6
ISBN (elektronisch)978-1-4673-1589-0, 978-1-4673-1591-3
ISBN (Print)978-1-4673-1590-6
PublikationsstatusVeröffentlicht - 23 März 2012
Peer-Review-StatusJa

Publikationsreihe

ReiheIEEE SSD International Multi-Conference on Systems, Signals and Devices
ISSN2474-0438

Konferenz

Titel9th International Multi-Conference on Systems, Signals & Devices
KurztitelIEEE SSD 2012
Dauer20 - 23 März 2012
BekanntheitsgradInternationale Veranstaltung
StadtChemnitz
LandDeutschland

Externe IDs

Scopus 84861631328

Schlagworte

Schlagwörter

  • Insulated gate bipolar transistors, Junctions, Semiconductor diodes, Switches, Mathematical model, Temperature, Inverters