A stretchable EMI measurement sheet with 8×8 coil array, 2V organic CMOS decoder, and −70dBm EMI detection circuits in 0.18¼m CMOS
Publikation: Beitrag in Buch/Konferenzbericht/Sammelband/Gutachten › Beitrag in Konferenzband › Beigetragen › Begutachtung
Beitragende
Abstract
Electromagnetic interference (EMI) is a serious issue degrading the dependability of electronic devices. The issue is complicated by the following technology trends: 1) RF signals and clock pulses of digital ICs are in the same frequency range. 2) The increase of LSI power consumption causes an increase of noise emission. 3) Electronic devices have 3D-structures and packaging is dense. These trends also make the root cause analysis of EMI difficult. For example, it is difficult to find the EMI generation points in electronic devices such as cell-phones and PDAs.
Details
| Originalsprache | Englisch |
|---|---|
| Titel | 2009 IEEE International Solid-State Circuits Conference - Digest of Technical Papers |
| Herausgeber (Verlag) | Institute of Electrical and Electronics Engineers (IEEE) |
| Seiten | 472-473 |
| Seitenumfang | 2 |
| ISBN (Print) | 978-1-4244-3458-9 |
| Publikationsstatus | Veröffentlicht - 12 Feb. 2009 |
| Peer-Review-Status | Ja |
Konferenz
| Titel | 2009 IEEE International Solid-State Circuits Conference - Digest of Technical Papers |
|---|---|
| Dauer | 8 - 12 Februar 2009 |
| Ort | San Francisco, CA, USA |
Externe IDs
| Scopus | 70349291206 |
|---|---|
| ORCID | /0000-0002-4152-1203/work/165453395 |
Schlagworte
Schlagwörter
- Electromagnetic interference, Coils, Decoding, Circuits, Electromagnetic measurements, Thermal degradation, CMOS technology, Clocks, Frequency, Large scale integration