A low-noise energy-efficient inductor-less 50 Gbit/s transimpedance amplifier with high gain-bandwidth product in 0.13 μm SiGe BiCMOS

Publikation: Beitrag in Buch/Konferenzbericht/Sammelband/GutachtenBeitrag in KonferenzbandBeigetragenBegutachtung

Abstract

A 50 Gbit/s transimpedance amplifier input stage implemented in a 0.13 μm SiGe BiCMOS technology with high gain-bandwidth product, high energy efficiency and low noise is presented. The amplifier is designed to act as an input stage of an integrated receiver front-end. The circuit consists of a low stage count topology and achieves a high transimpedance over a large bandwidth without applying area consuming peaking inductors. Measurements of the fabricated chip show a forward gain of more than 16 dB and a transimpedance gain of 53.5 dB over a bandwidth of 35 GHz. The circuit consumes a power of less than 14 mW from a 3.3 V supply and requires a chip area of only 0.158 mm 2 including pads.

Details

OriginalspracheEnglisch
TitelInternational Semiconductor Conference Dresden - Grenoble (ISCDG)
ErscheinungsortDresden
Herausgeber (Verlag)IEEE Xplore
ISBN (elektronisch)978-1-4799-1251-3
ISBN (Print)9781479912506
PublikationsstatusVeröffentlicht - 2013
Peer-Review-StatusJa

Publikationsreihe

ReiheInternational Semiconductor Conference Dresden (ISCDG)

Konferenz

Titel2013 IEEE International Semiconductor Conference Dresden - Grenoble: Technology, Design, Packaging, Simulation and Test, ISCDG 2013
Dauer26 - 27 September 2013
StadtDresden
LandDeutschland

Externe IDs

ORCID /0000-0002-1851-6828/work/142256659

Schlagworte

Forschungsprofillinien der TU Dresden

Ziele für nachhaltige Entwicklung

ASJC Scopus Sachgebiete

Schlagwörter

  • BiCMOS, optical communication, optoelectronic integrated circuit, SiGe, transimpedance amplifier (TIA)