A low-noise energy-efficient inductor-less 50 Gbit/s transimpedance amplifier with high gain-bandwidth product in 0.13 μm SiGe BiCMOS
Publikation: Beitrag in Buch/Konferenzbericht/Sammelband/Gutachten › Beitrag in Konferenzband › Beigetragen › Begutachtung
Beitragende
Abstract
A 50 Gbit/s transimpedance amplifier input stage implemented in a 0.13 μm SiGe BiCMOS technology with high gain-bandwidth product, high energy efficiency and low noise is presented. The amplifier is designed to act as an input stage of an integrated receiver front-end. The circuit consists of a low stage count topology and achieves a high transimpedance over a large bandwidth without applying area consuming peaking inductors. Measurements of the fabricated chip show a forward gain of more than 16 dB and a transimpedance gain of 53.5 dB over a bandwidth of 35 GHz. The circuit consumes a power of less than 14 mW from a 3.3 V supply and requires a chip area of only 0.158 mm 2 including pads.
Details
Originalsprache | Englisch |
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Titel | International Semiconductor Conference Dresden - Grenoble (ISCDG) |
Erscheinungsort | Dresden |
Herausgeber (Verlag) | IEEE Xplore |
ISBN (elektronisch) | 978-1-4799-1251-3 |
ISBN (Print) | 9781479912506 |
Publikationsstatus | Veröffentlicht - 2013 |
Peer-Review-Status | Ja |
Publikationsreihe
Reihe | International Semiconductor Conference Dresden (ISCDG) |
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Konferenz
Titel | 2013 IEEE International Semiconductor Conference Dresden - Grenoble: Technology, Design, Packaging, Simulation and Test, ISCDG 2013 |
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Dauer | 26 - 27 September 2013 |
Stadt | Dresden |
Land | Deutschland |
Externe IDs
ORCID | /0000-0002-1851-6828/work/142256659 |
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Schlagworte
Forschungsprofillinien der TU Dresden
Ziele für nachhaltige Entwicklung
ASJC Scopus Sachgebiete
Schlagwörter
- BiCMOS, optical communication, optoelectronic integrated circuit, SiGe, transimpedance amplifier (TIA)