A highly reliable 1.8 V 1 Mb Hf0.5Zr0.5O2-based 1T1C FeRAM Array with 3-D Capacitors

Publikation: Beitrag in Buch/Konferenzbericht/Sammelband/GutachtenBeitrag in KonferenzbandBeigetragenBegutachtung

Beitragende

  • Jun Okuno - , Sony Group Corporation (Autor:in)
  • Takafumi Kunihiro - , Sony Group Corporation (Autor:in)
  • Tsubasa Yonai - , Sony Group Corporation (Autor:in)
  • Ryo Ono - , Sony Group Corporation (Autor:in)
  • Yusuke Shuto - , Sony Group Corporation (Autor:in)
  • Ruben Alcala - , Professur für Nanoelektronik, NaMLab - Nanoelectronic materials laboratory gGmbH (Autor:in)
  • Maximilian Lederer - , Fraunhofer-Institut für Photonische Mikrosysteme (Autor:in)
  • Konrad Seidel - , Fraunhofer-Institut für Photonische Mikrosysteme (Autor:in)
  • Thomas Mikolajick - , Professur für Nanoelektronik, NaMLab - Nanoelectronic materials laboratory gGmbH (Autor:in)
  • Uwe Schroeder - , Technische Universität Dresden, NaMLab - Nanoelectronic materials laboratory gGmbH (Autor:in)
  • Masanori Tsukamoto - , Sony Group Corporation (Autor:in)
  • Taku Umebayashi - , Sony Group Corporation (Autor:in)

Abstract

This study proposes a novel 1 Mb one-transistor one-capacitor ferroelectric random access memory array based on ferroelectric Hf0.5Zr0.5O2 with 3D cylindrical capacitors. We obtain a perfect functionality with a sufficient memory window at a small projected cylinder area of 0.028 µm2 at an operating voltage of 1.8 V by reducing the CBL and optimizing the structure of the capacitors. We achieve a cycling endurance of 1011 cycles and 1-month retention at 85°C. The reliability is further improved to over 1012 cycles and 10 years at 85°C retention if the operating voltage is increased to 2.4 V. This technology matches the requirements of last-level cache and low-power systems in chips for Internet of Things applications.

Details

OriginalspracheEnglisch
Titel2023 International Electron Devices Meeting, IEDM 2023
Herausgeber (Verlag)Institute of Electrical and Electronics Engineers (IEEE)
Seiten1-4
ISBN (elektronisch)9798350327670
PublikationsstatusVeröffentlicht - 2023
Peer-Review-StatusJa

Publikationsreihe

ReiheTechnical Digest - International Electron Devices Meeting, IEDM
ISSN0163-1918

Konferenz

Titel2023 International Electron Devices Meeting
UntertitelDevices for a Smart World Built Upon 60 Years of CMOS
KurztitelIEDM 2023
Veranstaltungsnummer69
Dauer9 - 13 Dezember 2023
Webseite
OrtHilton San Francisco Union Square
StadtSan Francisco
LandUSA/Vereinigte Staaten

Externe IDs

ORCID /0000-0003-3814-0378/work/156338403