Ultracompact SOI CMOS frequency doubler for low power applicationsat 26.5-28.5 GHz

Publikation: Beitrag in FachzeitschriftForschungsartikelBeigetragenBegutachtung

Beitragende

Abstract

In this paper, a complementary metal oxide semiconductor (CMOS) frequencydoubler for wireless applications at Ka-band is presented. The microwavemonolithic integrated circuit (MMIC) is fabricated using digital90 nm silicon on insulator (SOI) technology. All impedance matching,filter and bias elements are implemented on the chip, which has avery compact size of 0.37 mm/spl times/0.27 mm. At an output frequencyof 27 GHz, source/load impedances of 50 /spl Omega/, a supply voltageof 1.25 V, a supply current of 8 mA and an input power of -4.5 dBm,a conversion gain of 1.5 dB was measured. To the knowledge of theauthors, the circuit has by far the highest operation frequency fora CMOS frequency multiplier reported to date and requires lower supplypower than circuits using leading edge III/V and silicon germanium(SiGe) technologies.

Details

OriginalspracheEnglisch
Seiten (von - bis)53-55
Seitenumfang3
FachzeitschriftIEEE microwave and wireless components letters
Jahrgang14
Ausgabenummer2
PublikationsstatusVeröffentlicht - 1 Feb. 2004
Peer-Review-StatusJa

Externe IDs

Scopus 12144290115

Schlagworte

Schlagwörter

  • CMOS integrated circuits, MMIC, frequency multipliers, low-power electronics, silicon-on-insulator CMOS frequency multiplier, IH-V and silicongermanium technologies, Ka-band, SOI CMOS frequency doubler, biaselements, complementary metal oxide semiconductor, conversion gain, filter element, impedance matching, input power, low power applications, lower supply power circuits, microwave monolithic integrated circuit, operation frequency, output frequency, silicon on insulator, source-loadimpedances, supply current, supply voltage