New mobile communication standards such as 5G, 6G and beyond require further miniaturisation of complex components such as waveguides or filters made of pure copper. Previous manufacturing methods for 3D components have reached their limits in terms of precision and productivity. As a new sinter-based additive process, lithography-based metal manufacturing (LMM) enables the economical and high-precision production of such components with structure widths of around 100 µm. Since only steels have been available in LMM so far, the material copper was developed for LMM for the first time in this work. The entire process chain from powder selection, paste formulation and printing process parameters to debinding and sintering was investigated. Special emphasis was focused on the achievable geometries and the material properties in order to achieve high purity, excellent debinding quality and high sintering density.