Quasi-Optical Directional Coupler Based on 3D-Printed Dielectric Image Lines for sub-THz Applications

Publikation: Beitrag in Buch/Konferenzbericht/Sammelband/Gutachten › Beitrag in Konferenzband › Beigetragen › Begutachtung

Beitragende

  • Leonhard Hahn - , Friedrich-Alexander-Universität Erlangen-Nürnberg (Autor:in)
  • Lukas Bürk - , Friedrich-Alexander-Universität Erlangen-Nürnberg (Autor:in)
  • Yu Zhu - , Professur für Schaltungstechnik und Netzwerktheorie (Autor:in)
  • Christian Carlowitz - , Friedrich-Alexander-Universität Erlangen-Nürnberg (Autor:in)
  • Gerald Gold - , Friedrich-Alexander-Universität Erlangen-Nürnberg (Autor:in)
  • Frank Ellinger - , Professur für Schaltungstechnik und Netzwerktheorie (Autor:in)
  • Martin Vossiek - , Friedrich-Alexander-Universität Erlangen-Nürnberg (Autor:in)

Abstract

This paper presents a 3D-printed dielectric directional coupler for the sub-THz band from 140GHz to 220GHz. In contrast to conventional coupling approaches, a quasi-optical operating principle is implemented, which is based on the insertion of a thin dielectric boundary within a dielectric image guide. Due to an intended permittivity shift, the boundary layer acts as a wavesplitter for incident HE11 waves, whose partial reflections are selectively controllable via material or geometry parameters. This results in significant advantages in terms of achievable bandwidth and required dimensions, while manufacturing costs and complexity are minimized at the same time using additive manufacturing. The realized coupler exhibits broadband matching of approx. 20dB, with high isolation of 25dB and achieves freely configurable, reproducible broadband coupling attenuation between 5dB and 15dB. Due to the remarkable simplicity and small size of the concept, this demonstrates a promising key component for low-loss, large-scale, dielectric sub-THz signal distribution networks.

Details

OriginalspracheEnglisch
Titel2024 54th European Microwave Conference, EuMC 2024
Herausgeber (Verlag)Institute of Electrical and Electronics Engineers (IEEE)
Seiten208-211
Seitenumfang4
ISBN (elektronisch)978-2-87487-077-4
ISBN (Print)979-8-3503-8589-2
PublikationsstatusVeröffentlicht - Okt. 2024
Peer-Review-StatusJa

Publikationsreihe

ReiheEuropean Microwave Conference (EuMC)

Konferenz

Titel54th European Microwave Conference
KurztitelEuMC 2024
Veranstaltungsnummer54
Beschreibungpart of European Microwave Week 2024
Dauer24 - 26 September 2024
Webseite
StadtParis
LandFrankreich

Schlagworte

ASJC Scopus Sachgebiete

Schlagwörter

  • 3D-printing, Dielectric image lines, directional coupler, quasi-optical, sub-THz