One-way vs. two-way coupled simulation: Investigation of thermal management of wireless power transfer modules for electric vehicles
Publikation: Beitrag in Buch/Konferenzbericht/Sammelband/Gutachten › Beitrag in Konferenzband › Beigetragen › Begutachtung
Beitragende
Abstract
The thermal management of vehicular wireless power transfer modules featuring a high volumetric power density is a major challenge. Taking into account the interaction of the electromagnetic and thermal field leads to extensive computational effort for a simulative prediction of the thermal behavior. One approach for reducing the required computational effort is the use of one-way coupled simulations. In this context, the presented paper addresses the quantitatively comparison of one-way and two-way coupled electromagnetic-thermal simulation models to predict the thermal behavior of an exemplary vehicular wireless power transfer module. The performed studies show a good consistency of the two-way coupled simulation results compared to the experimental validation, whereas the one-way coupled model predicts overall too low temperatures. Thus, two-way coupled simulation models are therefore recommended for the electromagnetic-thermal dimensioning of wireless power transfer modules for electric vehicles.
Details
Originalsprache | Englisch |
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Titel | 2022 Wireless Power Week, WPW 2022 - Proceedings |
Herausgeber (Verlag) | IEEE, New York [u. a.] |
Seiten | 84-89 |
Seitenumfang | 6 |
ISBN (elektronisch) | 978-1-6654-8445-9, 978-1-6654-8444-2 |
ISBN (Print) | 978-1-6654-8446-6 |
Publikationsstatus | Veröffentlicht - 17 Aug. 2022 |
Peer-Review-Status | Ja |
Konferenz
Titel | 2022 Wireless Power Week, WPW 2022 |
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Dauer | 5 - 8 Juli 2022 |
Stadt | Bordeaux |
Land | Frankreich |
Externe IDs
Mendeley | 7c9734a0-1d23-3a06-9ae7-fd1b6a8374de |
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unpaywall | 10.1109/wpw54272.2022.9854041 |
ORCID | /0000-0003-2834-8933/work/142238427 |
ORCID | /0000-0002-8854-7726/work/142242114 |
Schlagworte
ASJC Scopus Sachgebiete
Schlagwörter
- electric vehicle, electromagnetic-thermal simulation, multiphysical testing, wireless power transfer