The ongoing development of power modules for electronics in the field of electromobility, charging infrastructure and photovoltaic based on SiC chips come up with a strong demand on tailored thermal management materials with high thermal conductivity, tailored coefficient of thermal expansion, soldering workability and a way for industrial production. In this paper the developed routine for the industrial production of metal diamond composites inspired by the wafer technology for semiconductors will be presented using the example of copper diamond composite. For the material integration into power modules by soldering the composite needs a cover with pure copper on both sides. The cross section, thermal conductivity and coefficient of thermal expansion will be displayed for the single composite, the covered composite and after integration into active metal braze (AMB) substrate. Aspects for the further integration into a power module design will be discussed and shown for one example.