Longitudinal Dielectric Interfaces with Microstructures
Publikation: Beitrag in Fachzeitschrift › Konferenzartikel › Beigetragen › Begutachtung
Beitragende
Abstract
Solid-solid interfaces e.g., in cable accessories are important to achieve a necessary dielectric performance. However, within the sealing, the possibility of voids and cracks is not completely avoidable and needs to be focused. Such imperfect dielectric tightness at the interfaces increases localized electric field leading to partial discharges and subsequent breakdown process. Herein, we report, enhancement in electrical interface strength by using controlled structural features (Wrinkles) on the surface of longitudinal interface materials. Electric field simulations were done on these structures using different positioning of electrodes concerning the wrinkle shape. In addition, the trajectory of electron given by the wrinkle shape towards the high voltage electrode is measured along with ionization coefficient responsible for the avalanche mechanism.
Details
Originalsprache | Englisch |
---|---|
Seiten (von - bis) | 116-120 |
Seitenumfang | 5 |
Fachzeitschrift | IET Conference Proceedings |
Jahrgang | 2023 |
Ausgabenummer | 46 |
Publikationsstatus | Veröffentlicht - 2023 |
Peer-Review-Status | Ja |
Extern publiziert | Ja |
Konferenz
Titel | 23rd International Symposium on High Voltage Engineering, ISH 2023 |
---|---|
Dauer | 28 August - 1 September 2023 |
Stadt | Glasgow |
Land | Großbritannien/Vereinigtes Königreich |
Schlagworte
ASJC Scopus Sachgebiete
Schlagwörter
- ELECTRIC FIELD, INTERFACE, IONIZATION, TRAJECTORY, VOIDS, WRINKLES