A joining technique for SiC ceramics, which can significantly increase the material's application potential at high temperatures and/or in chemically aggressive media, has been the subject of a cooperative development project). The technique is a laser soldering process using high-temperature solder (>1600°C) that requires no preparatory treatment (e.g. metallizing) of the parts to be joined and no gas shielding. This paper looks at the properties of the CERALINK