In the production of power electronics, quality, and reliability are important factors. Especially, the connection layer between the chip and the ceramic-based substrate often includes defects which can reduce the heat dissipation in these areas. This can lead to overheating and, furthermore, reduce the lifetime of the component. In the worst case, such failures can have a huge impact on safety-relevant systems. Therefore, a quality control within the production line or at least before the packaging of the components is very important. Laser Speckle Photometry (LSP) provides a promising solution to this problem. Speckle patterns are generated by interfering light waves that are reflected by the illuminated surface. These patterns are closely linked to the surface state of the investigated samples. In this paper, a quality control concept based on LSP in the production process of power electronic chips for the automotive industry is presented. The aim is to find and evaluate the voids in the solder connection and, furthermore, determine the porosity in sintered connections. Especially, the size and location of these voids are of great interest. First investigations have shown promising results, finding defects with a size of less than 15% (v/v) of the actual connection layer of the chips. This proves that the LSP has a big potential to inspect the connection quality of chips during the manufacturing of power electronics.