Influence of nitrogen trap states on the electronic properties of high-k metal gate transistors
Publikation: Beitrag in Buch/Konferenzbericht/Sammelband/Gutachten › Beitrag in Konferenzband › Beigetragen › Begutachtung
Beitragende
Abstract
The origin of the defects associated with the nitridation of the interface layer between Si and HfO2 is investigated. The electronic properties change upon nitridation which impact severely the gate capacitance and gate leakage current. We modeled the temperature-dependent leakage current in SiON/HfO2 gate dielectrics for positive and negative gate voltages by means of a multi-phonon trap-assisted tunneling scheme to extract the trap distribution. The results are supported by charge pumping measurements and simulation. To clarify the origin of the additional traps in the SiON interface we performed ab-initio calculation and correlated the results with the gate leakage current measurements. Finally, we shed new light on the relation between stress-induced leakage current and positive bias temperature instability.
Details
Originalsprache | Englisch |
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Titel | 2014 IEEE International Workshop Integrated Reliability IIRW |
Herausgeber (Verlag) | IEEE Xplore |
Seiten | 86-89 |
Seitenumfang | 4 |
ISBN (elektronisch) | 978-1-4799-7274-6, 978-1-4799-7286-9 |
ISBN (Print) | 9781479973088 |
Publikationsstatus | Veröffentlicht - 2014 |
Peer-Review-Status | Ja |
Publikationsreihe
Reihe | IEEE International Integrated Reliability Workshop (IIRW) |
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ISSN | 1930-8841 |
Konferenz
Titel | 2014 IEEE International Integrated Reliability Workshop |
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Kurztitel | IIRW 2014 |
Dauer | 12 - 16 Oktober 2014 |
Ort | Stanford Sierra Conference Center |
Stadt | South Lake Tahoe |
Land | USA/Vereinigte Staaten |
Externe IDs
ORCID | /0000-0003-3814-0378/work/142256294 |
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Schlagworte
ASJC Scopus Sachgebiete
Schlagwörter
- Charge Pumping, Gate Leakage, High-k Metal Gate Dielectric, Interfacial Layer, Stress-Induced Leakage Current