Fundamentals of Electromigration-Aware Integrated Circuit Design
Publikation: Buch/Konferenzbericht/Sammelband/Gutachten › Monographie › Beigetragen › Begutachtung
Beitragende
Abstract
The book provides a comprehensive overview of electromigration and its effects on the reliability of electronic circuits. This second edition has been updated to introduce recent advancements in the understanding of the physical process of electromigration, which gives the reader the knowledge for adopting appropriate counter measures. A comprehensive set of options is presented for modifying the present IC design methodology to prevent electromigration. Finally, the authors show how specific effects can be exploited in present and future technologies to reduce electromigration’s negative impact on circuit reliability.
Details
| Originalsprache | Englisch |
|---|---|
| Verlag | Springer International Publishing |
| Seitenumfang | 167 |
| Auflage | 2. |
| ISBN (elektronisch) | 978-3-031-80023-8 |
| ISBN (Print) | 978-3-031-80022-1, 978-3-031-80025-2 |
| Publikationsstatus | Veröffentlicht - 2025 |
| Peer-Review-Status | Ja |
Externe IDs
| Scopus | 105004505656 |
|---|---|
| Mendeley | 02fc91de-9e87-3910-99d9-747f48fd5d83 |
Schlagworte
ASJC Scopus Sachgebiete
- Allgemeine Computerwissenschaft - Blech length, VLSI design, circuit design, current density, electromigration, interconnect reliability, physical design, reservoir effect, short-length effects, short-line rules
- Allgemeiner Maschinenbau - Blech length, VLSI design, circuit design, current density, electromigration, interconnect reliability, physical design, reservoir effect, short-length effects, short-line rules
Schlagwörter
- Blech length, VLSI design, circuit design, current density, electromigration, interconnect reliability, physical design, reservoir effect, short-length effects, short-line rules