Epoxy Resin Adhesives for Point Fixings – A New Approach

Publikation: Beitrag zu KonferenzenPaperBeigetragenBegutachtung

Abstract

The wide acceptance of glass as a building material encourages many requests for transparent, almost dematerialized appearing building envelopes. This requires glass structures, which are increasingly involved in the load transfer. However, glass is a brittle material. Adhesively bonded connections allow substance-to-substance bonds of the adherend parts with a homogeneous distribution of forces while reducing local stress peaks. Besides the usual mechanical connections, load bearing, structural bonds therefore becoming considerably important for glass as appropriate for the involved material.

Epoxy resin adhesives are especially suited for structural bonding for point fixings. A variety of commercially available epoxy resin adhesives is known and has different areas of application, like automotive industry, mechanical engineering as well as construction engineering. For point fixings in glass constructions, e.g. façades or railings, transparent adhesives will be best suited. According to our research and investigations an optimally appropriate adhesive could not be identified so far. Especially the thermal stability and resistance to ageing is insufficient for outdoor applications.
Beginning with basic formulations for epoxy resin adhesives, proper starting materials are determined by examination of the thermo-mechanical, mechanical and chemical properties. This is followed by the study of the ageing stability of the different formulations. The basic formulations are then modified by the addition of fillers and additives. This influenced the mechanical strength and the thermal stability as well as the location of the glass transition region. Even the ageing behaviour could be positively changed by these modifications.

Details

OriginalspracheEnglisch
Seiten49-55
PublikationsstatusVeröffentlicht - 2015
Peer-Review-StatusJa

Konferenz

Titelin-adhesives, Symposium on Innovations in Adhesives and their Applications
UntertitelAdhesives of the Future - Future of Adhesives
Dauer4 Februar 2015
BekanntheitsgradInternationale Veranstaltung
StadtMünchen
LandDeutschland

Externe IDs

ORCID /0000-0001-8714-5963/work/142246833

Schlagworte

Forschungsprofillinien der TU Dresden

Fächergruppen, Lehr- und Forschungsbereiche, Fachgebiete nach Destatis

Ziele für nachhaltige Entwicklung

ASJC Scopus Sachgebiete

Schlagwörter

  • epoxy resin, structural bonding, adhesive modification