Because of the difference between the expansion coefficients of ceramics and metals, residual stress fields arise in a ceramic-metal bond during the soldering process; these stresses can result in bond failure if the tensile strength of the ceramic partner is exceeded. In optimizing composite structure for material compatibility, therefore, the objective is, on the one hand, to achieve a design strategy which minimizes residual tensile stresses due to the manufacturing process and, on the other hand, allows for a compressive load on the ceramic component during operation. For this purpose, a variation of material and geometrical parameters is performed as indicated for the example of a circular ceramic-metal plate composite.