Design and Experimental Evaluation of 60 GHz Self-compensating Bond-wire Interconnect

Publikation: Beitrag in Buch/Konferenzbericht/Sammelband/GutachtenBeitrag in KonferenzbandBeigetragenBegutachtung

Abstract

In this paper, a bond-wire impedance compensation technique based on using bond-wires as a half-wavelength long transmission line is designed, implemented and experimentally verified for a 60 GHz interconnection between an integrated circuit (IC) and printed circuit board (PCB). For this purpose, electromagnetic simulations (EM) of the entire interconnection i.e. the IC, the bond-wire and the PCB are performed and subsequently characterized experimentally. The comparison of the measurements with the simulations shows a good agreement. It is found that although the bond wires are about 2.4 mm long, the measured insertion loss is better than 0.66 dB at 60 GHz and a −10 dB reflection bandwidth from 57.5 GHz to 64 GHz can be achieved. Furthermore a technique is proposed to ease the implementation of such a long interconnection and to help in maintaining the desired parallelism between the bond-wires

Details

OriginalspracheEnglisch
Titel21st IEEE Interregional NEWCAS Conference, NEWCAS 2023 - Proceedings
Herausgeber (Verlag)IEEE Xplore
Seitenumfang5
ISBN (elektronisch)9798350300246
PublikationsstatusVeröffentlicht - Juni 2023
Peer-Review-StatusJa

Konferenz

Titel21st IEEE Interregional NEWCAS Conference
KurztitelNEWCAS 2023
Veranstaltungsnummer21
Dauer26 - 28 Juni 2023
Webseite
BekanntheitsgradInternationale Veranstaltung
OrtJohn McIntyre Conference Centre
StadtEdinburgh
LandGroßbritannien/Vereinigtes Königreich

Externe IDs

Scopus 85168545175
Mendeley 1aaa40dd-69a5-38f1-ba3a-7084999829b6
ORCID /0000-0001-5748-3005/work/142239385
ORCID /0000-0001-6778-7846/work/142240166
ORCID /0000-0003-2197-6080/work/142254594

Schlagworte

Schlagwörter

  • Bond-wire, Impedance matching, Voltage controlled Oscillator, integrated circuit interconnects, millimeter wave measurements, phase locked loops