Adhesives are widely used in electronic packaging and are of vital importance in the reliability of electronic systems. A deep understanding of the degradation mechanism of adhesives under corrosion load plays a key role in lifetime prediction. Unfortunately, most of the common reliability tests are destructive. The present approach combines the nondestructive methods, electrochemical impedance spectroscopy and the Fourier-transform infrared spectroscopy, as powerful tools in a complementary manner to describe the degradation mechanism and kinetics of two epoxy-based adhesives, which are commonly used in electronic packaging. It is demonstrated that the application quality is the dominating impact on the optimization of the lifetime.