Comparison of press-pack IGBT at hard switching and clamp operation for medium voltage converters

Publikation: Beitrag in Buch/Konferenzbericht/Sammelband/GutachtenBeitrag in KonferenzbandBeigetragenBegutachtung

Beitragende

Abstract

The newly developed press-pack IGBT devices compete with IGCTs in high power industrial applications. These new semiconductors were already studied in detail for hard switching [1] and for clamp operation [2]. Nevertheless, a comparison of the basic switching characteristics of the IGBT press-pack devices for hard switching and clamp operation has not been done so far. This paper compares the switching behavior, the switching losses and the safe operating area trajectories of the new 85 mm, 4.5 kV, 1.2 kA press-pack SPT+ IGBT for hard switching and clamp operation. The methods used for the experimental characterization and comparison are explained in detail.

Details

OriginalspracheEnglisch
TitelProceedings of the 2011 14th European Conference on Power Electronics and Applications
Herausgeber (Verlag)IEEE Xplore
ISBN (elektronisch)978-90-75815-14-6, 978-90-75815-15-3
ISBN (Print)978-1-61284-167-0
PublikationsstatusVeröffentlicht - 2011
Peer-Review-StatusJa

Publikationsreihe

Reihe European Conference on Power Electronics and Applications (EPE; ECCE)

Konferenz

Titel2011 14th European Conference on Power Electronics and Applications, EPE 2011
Veranstaltungsnummer14
Dauer30 August - 1 September 2011
StadtBirmingham
LandGroßbritannien/Vereinigtes Königreich

Schlagworte

ASJC Scopus Sachgebiete

Schlagwörter

  • Device application, Device characterization, IGBT, Industrial application, Packaging, Test bench