ELEKTRONISCHES BAUELEMENT UND VERFAHREN ZUM HERSTELLEN EINES ELEKTRONISCHEN BAUELEMENTS
Research output: Intellectual Property › Patent application/Patent
Contributors
Abstract
An electronic component (100) is provided in various embodiments. The electronic component (100) can comprise: - a substrate (102), the substrate (102) having a plurality of input electrodes (106) and a plurality of output electrodes (104), which are disposed on and/or in the substrate (102) at a distance from each other; and - an electrically conductive network made of one or more electrically conductive polymers, the electrically conductive network being designed to electrically link the plurality of input electrodes to the plurality of output electrodes.
Translated title of the contribution | ELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN ELECTRONIC COMPONENT |
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Details
An electronic component (100) is provided in various embodiments. The electronic component (100) can comprise: - a substrate (102), the substrate (102) having a plurality of input electrodes (106) and a plurality of output electrodes (104), which are disposed on and/or in the substrate (102) at a distance from each other; and - an electrically conductive network made of one or more electrically conductive polymers, the electrically conductive network being designed to electrically link the plurality of input electrodes to the plurality of output electrodes.
Original language | German |
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IPC (International Patent Classification) | H01L 51/ 05 A I |
Patent number | WO2021254769 |
Country/Territory | Germany |
Priority date | 15 Jun 2020 |
Priority number | DE202010115713 |
Publication status | Published - 23 Dec 2021 |