Characterization of material adhesion in redistribution multilayer for embedded high-frequency packages
Research output: Contribution to book/conference proceedings/anthology/report › Conference contribution › Contributed
Contributors
Details
Original language | Undefined |
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Title of host publication | Proceedings of the IEEE-EPS Electronics System-Integration Technology Conferences (ESTC) |
Publication status | Published - 16 Sept 2022 |
Peer-reviewed | No |
External IDs
ORCID | /0000-0002-0757-3325/work/139064786 |
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