Characterization of material adhesion in redistribution multilayer for embedded high-frequency packages

Research output: Contribution to book/conference proceedings/anthology/reportConference contributionContributed

Contributors

Details

Original languageUndefined
Title of host publicationProceedings of the IEEE-EPS Electronics System-Integration Technology Conferences (ESTC)
Publication statusPublished - 16 Sept 2022
Peer-reviewedNo

External IDs

ORCID /0000-0002-0757-3325/work/139064786

Keywords